Today’s superior packaging know-how depends on innovative course of methods to provide improved IC element efficiency and multi-function integration. To forestall defective devices from shifting forward in the supply chain, screening and sorting are essential quality control steps for packaged IC parts, IC substrates and printed circuit boards . Inspection and metrology techniques capture critical defects and variations for the continual enchancment of packaging and PCB processes, reliability-related issues and device failure traceability.
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